Electronics Forum | Mon Oct 16 11:25:11 EDT 2006 | charless
Yes of course. The leg of the component breaks between the top of the solder joint and the component body. We can induce the same failure mode with lead free joints but usually after 10x longer on vibration.
Electronics Forum | Wed Oct 18 08:00:53 EDT 2006 | davef
Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?
Electronics Forum | Wed Nov 29 00:16:34 EST 2006 | mack3000
Hello everyone, May i know what is the acceptable component throwout rate/percentage for a smt machine(chip shooter and chip placer)in the industry today?
Electronics Forum | Wed Nov 29 01:20:44 EST 2006 | fastek
Guess- If a component drops at the camera the machine will not proceed to attempt to place it and drive the nozzle into a brick of solder paste. The line sensor will catch the fact there is no component on the nozzle and will retry to pick and place.
Electronics Forum | Tue Dec 19 03:37:12 EST 2006 | aj
Not quite sure what your problem is by your explanation but if you are seeing component shifting with no real trend , I would be confident that it will be down to the Clamping of the board. Make sure the adjustable rail is secure and not moving sligh
Electronics Forum | Wed Jan 03 12:08:43 EST 2007 | patrickbruneel
What I would suggest trying is to only use your bottom heaters in your oven. In this way the board will receive the majority of the heat and conduct the heat to the component. Since your components are small and your board is more then twice the stan
Electronics Forum | Tue Jan 16 03:05:32 EST 2007 | aj
All, The component that seems to be effected most is a : NemeriX NJ1006A QFN type device. If heat isthe problem what exactly is happening to the part -cold spots? joints not soldered? aj...
Electronics Forum | Thu Jan 18 10:59:26 EST 2007 | aj
All, apologies for dragging this thread up again but after some xray analysis it looks like there is no issue with the soldering of any components namely 2 x bga and 1 qfn device which are placed within the shielding area..but yet they fail to perfo
Electronics Forum | Tue Feb 20 23:46:38 EST 2007 | Muhammad Haris
hi Jax the nozzle which i am using for these components are also used for large SOPs and other components so i cant blame my nozzles.The problem is, they always shift to some 5 degree plus but some times it place them accurately.
Electronics Forum | Mon Mar 12 08:27:00 EDT 2007 | rgduval
Have you checked the parts for contamination? Are the voids out of spec? IPC allows some voiding, especially with lead free solder. Component contamination can cause this to repeat, as well. Try pre-tinning the component in question, and see if s
