Electronics Forum: components (Page 26 of 1140)

Tantalum influence on other components

Electronics Forum | Wed Jan 17 05:05:30 EST 2007 | Phil J

The most likely cause is moisture vapor outgassing violently from the Tant package. They are known to be moisture sensitive. Try baking some at 120C overnight and reflowing those.

Tantalum influence on other components

Electronics Forum | Wed Jan 17 05:32:21 EST 2007 | vovika

Maybe, but distance between Tantalum capacitor and BGA is about 1cm. Also how evaporation can affect on the BGA balls and can be cause of short?

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:20:19 EST 2007 | slthomas

I'm inclined to suggest that you use a specified temperature, thus eliminating your situation. Why not use 90�C? I suppose you could calculate a duration for 70 based on the requirements at 40 and 90 if you really wanted to, but still I wonder why.

Baking components at 70 degree

Electronics Forum | Fri Jun 06 22:34:20 EDT 2008 | sleech

We have spent more than two years characterizing 70 deg C dry baking. For more information visit our website http://www.InnovativeDryingCo.com I hope you find your answers there Best Regards Stu Leech

Baking components at 70 degree

Electronics Forum | Tue Jun 17 04:46:59 EDT 2008 | fowlerchang

Vacuum baking oven can solve it. At 70 degree and 24 hours. And the vacuum is below than 10pa

Baking components at 70 degree

Electronics Forum | Tue Jun 17 20:59:07 EDT 2008 | fowlerchang

And we have evaluated this process before 2001. And it is widely used in our company world wide. And we don't control the rate of the drop in pressure, because it is same as 125 degree at normal pressure condition.

Baking components at 70 degree

Electronics Forum | Thu Jun 19 07:41:25 EDT 2008 | davef

And that's the key thing for an assembler. Who cares if the part is bone dry? Assemblers want to get the part dry enough so that soldering process does not destroy the part, so that he /she can move on to the next issue.

Baking components at 70 degree

Electronics Forum | Tue Jun 24 21:01:27 EDT 2008 | fowlerchang

Qulification the baking process of 70 degree and 24 hours below 10Pa. We have the experiment data which shows the weight of baked water from package with this condition is more than 125 degree at normal condition.

Baking components at 70 degree

Electronics Forum | Wed Jun 25 08:06:04 EDT 2008 | davef

Questions are: * What does "weight of baked water from package with this condition [70 degree and 24 hours below 10Pa] is more than 125 degree at normal condition" mean? * What is "normal condition"?

Baking components at 70 degree

Electronics Forum | Wed Jun 25 22:18:53 EDT 2008 | fowlerchang

Sorry! I can't insert the document. So give me email if you want to receive this evaluation report. fowlerchang@rayval.com


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