Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Mon May 06 11:49:20 EDT 2002 | Jacob
Hello all, I am having soldering issues with an Everlight component it is a TM4201/TR2 (Right angle IRDA with a 1mm pitch). The problem I have is that after reflow the solder joints look perfect, but during test we are losing 7 micro amps as soon as
Electronics Forum | Thu Aug 29 20:04:13 EDT 2002 | davef
Steve: I agree. Let�s break it down. * I�d rather print paste than glue any day of the week * But I know yera �Dispenser Boy�. In that case, I�d rather dispense glue than paste. * PTH / primary and SMT / secondary is a tough process either way you
Electronics Forum | Thu Jan 02 12:15:10 EST 2003 | Mike Konrad
Richard, With respect to the Resistivity of Solvent Extract (ROSE) test, the test solution is exceptionally aggressive. With the Zero-Ion for example, the test solution�s resistivity is 150 M-Ohms. Additionally, because test solution is made up of
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Mon Apr 12 19:22:54 EDT 2004 | russ
So if I get this right, your customer wants you to run this product as pb free even though it is not. In order to run this as pb free you need to run pb free paste. If you use 63/37 paste at the higher temps I believe that in addition to the compon
Electronics Forum | Thu Feb 24 06:11:18 EST 2005 | siverts
Nozzle used? Nozzle tip damaged/worn-out (that's where the nozzle life comes in)? Component package? Heavy component? Feeder? Do You see that component type, used by that nozzle inside the machine, or components at the wrong spot on the pcb? If so, t
Electronics Forum | Tue May 31 18:08:45 EDT 2005 | K
All good points and thank you for your replies. Most of the components lost are discretes. The problem I have is my operators gather any SOIC "lost components" and return them to stores in a small metallised bag. This in turn goes into a 16" X 12" X
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