Electronics Forum | Fri Apr 24 17:14:27 EDT 1998 | Glenn Eubinag
Sounds like your running older equipment earlier than the latest C (oops "Q") series machines. If you are, the older Quad machines only vacuum verify at pick, not during transit to the placement location. Make sure that your vacuum setting is correc
Electronics Forum | Fri Apr 24 17:13:25 EDT 1998 | Glenn Eubinag
Sounds like your running older equipment earlier than the latest C series machines. If you are, the older Quad machines only vacuum verify at pick, not during transit to the placement location. Make sure that your vacuum setting is correct. Nozzle
Electronics Forum | Wed Apr 15 23:30:27 EDT 1998 | Scott McKee
| Wondering if anyone has information on percentage of components that we | can expect to "lose" during our SMT process. We are new to SMT, using | QUAD machines and feel we are losing to many parts during our process. | We are spending a lot of tou
Electronics Forum | Wed Apr 01 11:24:24 EST 1998 | niall hayes
Hello, We are currently trying to design and ultimately implement a system that will be able to count and manage component placement for three Sanyo chipshooters on three SMT lines. As the number of components decreases in the reels we want to be ab
Electronics Forum | Wed Jan 21 22:35:01 EST 1998 | Scott
| Is there anyone who can tell me what is the maximum allowable soldering temperature when soldering a TQFP (Thin Quad Flat Pack) device in a reflow oven? We recently used a CY7C375i in a TQFP160 package and we experienced warping (bending) of this c
Electronics Forum | Wed Dec 31 10:09:27 EST 1997 | Ken Daniels
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Wed Dec 31 08:55:09 EST 1997 | justin medernach
| Has anyone had any experience with thermal shocking | and cracking of SMD capacitors during the rework process? | My company was advised to preheat capacitors to 125 C | at a rate of 2 C/sec before replacing them onto boards. | Would this maybe
Electronics Forum | Wed Sep 26 16:32:40 EDT 2001 | davef
Placing a component the correct side up: * May affect heat dissipation. [Umm, that sounds like stretch, but who knows what designers think about?] * Allows reading the markings on those components that have markings, however cryptic the notation of
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Tue Dec 04 13:23:05 EST 2001 | fmonette
Hi Steve, It sounds like your product will have many moisture-sensitive devices on both sides. You should be aware of the additional controls that are required to insure the reliability of these components in a double-side reflow application. The
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