Electronics Forum | Fri May 16 13:43:29 EDT 2003 | T.Vick
Yukim, Just another thought (way off the solder paste trail that you've been on so far)....Are the parts similar in thickness? The 4796 and 4797 HSP's have a closed loop function that compensates for variations in component thickness based on fe
Electronics Forum | Thu May 22 00:21:27 EDT 2003 | AlCapone
The alternative is by looking at all your components data specs (heat-range), especially pay more attentions to heat-sensitive comps, and fine-pitch comps, odd-form comps, draw a diagram on a separate sheet of paper shown that temperature VS those ca
Electronics Forum | Tue Jun 10 11:07:33 EDT 2003 | fmonette
Another important element to consider is the impact of ambient temperature and humidity on Moisture Sensitive Components. The majority of plastic encapsulated ICs are classified as moisture-sensitive devices (MSD). This means that they are qualifie
Electronics Forum | Thu Jun 12 00:32:23 EDT 2003 | Henry
I would like to ask a question about SMT reflow process. I did 10 pcs samples but all is fail. The sample is double faces to have components (up-side has 4 pcs of BGA and down-side has 3 BGA and 2 QFP). And I saw some of BGA which is tilting in the P
Electronics Forum | Fri Jun 27 08:34:01 EDT 2003 | caldon
You should also look at the Semiconductor assembly side as well. Datacon and others are working hard to knock down the barriers between SMT and Semi. Also look at process obsolescence! Flip chip has been around for year but has not made it into main
Electronics Forum | Fri Jul 11 09:58:18 EDT 2003 | Chris
Good Day Everyone, We are a contract manufacturer. We are constantly receiving MSD components in consignment kits that are not sealed, not in the right bags or have no desiccant. When this occurs, we bake the parts per JEDEC J-STD-033A. We recently
Electronics Forum | Wed Aug 06 21:47:25 EDT 2003 | Francisco De La Torre
I looking for some information about Lead cutting and forming equipments. In specific PPM information abour Tape feeding vs bowl feeding. For TO-92 components. Actually we have a tape feeding system and we have like 15000 PPM's, and we measuared the
Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea
I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which
Electronics Forum | Wed Aug 20 18:17:56 EDT 2003 | stefwitt
I guess we should differentiate between machine calibration, process reliability measurements and process capability study. For the machine calibration you use the machines own optical cameras, but for cpk or standard deviation you measure the place
Electronics Forum | Tue Aug 19 13:47:46 EDT 2003 | slthomas
What are you going to fill the chamber with when it needs to be opened? If you use air, will the evacuated components suck up any available moisture? I've never done anything like this with electronic components, but some of the more porous materi
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