Electronics Forum | Thu Aug 28 02:51:01 EDT 2014 | padawanlinuxero
When you say "selecting correct value of the small chip components during assembly", you are referring to caps and resistors? and that you want to know that the correct cap or resistor was place in the correct location? your assembly is surface moun
Electronics Forum | Tue Aug 26 17:50:52 EDT 2014 | dkrawchuk
Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company th
Electronics Forum | Thu Sep 25 04:46:41 EDT 2014 | arifa_anees
you should go for a dry box it would prevent the sensitive component. Though Moisture sensitive devices are packaged in a moisture barrier antistatic bag with a desiccant and a moisture indicator card which is sealed which could help you.
Electronics Forum | Wed Oct 29 10:36:33 EDT 2014 | blainemoran
Looking for a maintenance mode on the NPM-W where I can isolate and fire different components. For example if I suspected a bad motor is there a way to just attempt to fire that. Any advise?
Electronics Forum | Tue Nov 18 12:21:46 EST 2014 | nathanhawks12
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Electronics Forum | Wed Nov 19 15:48:48 EST 2014 | gregp
Thank You Adam...this is the type of input I am looking for. To summarize, you are an OEM that has gone through the process to remove most through hole parts from your assemblies. Those that remain are primarily connectors which may not require lea
Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon
class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.
Electronics Forum | Thu Jan 08 16:13:01 EST 2015 | rgeisz
Nope - I mean continuous production of components on film (tape) substrate - from a reel into the printer/dispenser, then into the P/P, then into the oven, then back to takeup reel.
Electronics Forum | Wed Jan 14 12:40:46 EST 2015 | dyoungquist
MSL is used for components (and possibly bare pcbs) that are going to go through a reflow oven process in the future. In most cases, populated pcb assemblies will not be going through the reflow oven process again. Therefore, it is not necessary to
Electronics Forum | Mon Feb 09 08:34:50 EST 2015 | saoasasd
In my case most of the PCBs are OSP finishing and worst case of MSD component on bottom side is level 3 (168 hours). You mean that PCB shelf life with bottom side assembled shoud be 84 hours?
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