Electronics Forum | Wed Nov 05 16:09:08 EST 2003 | Amol Kane
Hi, I am a Graduate student in SUNY Binghamton. I am currently working on an Odd Form Component Placement Machine Manufactured by Universal Instruments Name of the Machine is Vari-Cell II Flexible Assembly Workcell Model number 6515A This Machine ha
Electronics Forum | Tue Nov 18 07:37:35 EST 2003 | Chris Lampron
Good Morning Everyone, Recently we have received a directive from one of our customers regarding processing of ceramic chip caps. The directive states that soldering irons shall not be used to process or rework any ceramic chip cap anywhere in the p
Electronics Forum | Fri Nov 21 14:11:09 EST 2003 | russ
We have a customer with the same requirements. We use a hot air pen to rework the caps. This is supposed to eliminate the thermal shock that is present when a soldering iron is used. The solder iron tip temp is usually 600-700 degrees and comes int
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Tue Nov 02 12:21:54 EST 2004 | bschreiber
Smart Sonic has an entry level component to our StencilScan AOI system called the Assembly Module GT. The Assembly Module GT is low cost and will get the job done. Plus, the Assembly Module GT can be upgraded easily to the other Assembly Module produ
Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ
Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder
Electronics Forum | Tue Jan 13 12:43:24 EST 2004 | cyber_wolf
I have to disagree with Fastek. We only use dedicated tooling on our AP machines. Dedicated tooling pros: *Set up time is 90%+ faster than universal tooling. *It is very easy to train operators to install dedicated support plates. *You do not need
Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40
Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The
Electronics Forum | Thu Mar 04 12:34:48 EST 2004 | cyber_wolf
I know that many smaller companies clean their stencils the same way you do. If you get good results cleaning your stencils this way then I would say stick with the alcohol/wipe method. Take your stencil and put it under a microscope.If the aperture
Electronics Forum | Fri Mar 19 11:48:06 EST 2004 | Ken
This is the dilema during this transition period. Here is a tip: If you see typcial solder joints on a lead free process, but only on one component type....it probably has a significant quantity of lead in it (ex. Sn90/Pb10...and so on) If using T
