Electronics Forum | Tue Nov 09 16:52:50 EST 1999 | John Sims
Brian, We recently investigated a depaneling press that might suit your application. The labor savings over pizza cutting will probably make it justifiable for you. The company seems to be lesser known in the US, but is partnered with a Japanese c
Electronics Forum | Wed Nov 03 10:10:05 EST 1999 | John Thorup
This has come up a number of times recently and a search for intrusive reflow or pin in hole reflow will reveal several threads. Also a good resource is the link below. From what has been stated on many of these forums and my own pre-production tes
Electronics Forum | Fri Oct 29 09:36:42 EDT 1999 | Dave F
Chris: Thanks. SMTnet has a "Library." Buried deep within it is a listing of terms. The following is from that listing: Shadowing. When a component blocks the heat or solder wave flow from certain areas of the printed circuit board, resulting in
Electronics Forum | Thu Oct 21 10:09:28 EDT 1999 | Brian
Larry IMHO, I suppose theoretically, with SOME types of paste, it would be possible, but you would not be able to print the paste, place the components or reflow, because a lot more of the chemistry would have volatilised long before the flux and th
Electronics Forum | Thu Oct 14 20:03:18 EDT 1999 | John
Larry, If you are asking about how to package your component in tape and reel, I would contact the 3M company. There are many tape companies out there, but my company has been very happy with 3M. If they don't have a tape that's stock, they'll guide
Electronics Forum | Tue Oct 12 11:03:10 EDT 1999 | Mika Johnsson
| Just curious as to everyones thoughts on if you could chose to use F4G or an MCS-30. Which would you chose and why? | | | Larry J | | If you need connections to other systems (CAD,MRP,Optimization) then I think MCS coul be a better choice, s
Electronics Forum | Fri Oct 08 20:23:23 EDT 1999 | Bix
Can anyone tell me the formula/method to determine the amount of weight that solder's surface tension can support. (ie: Maximum weight of components soldered onto a bottom side of a board during a top side reflow on a Paste/Paste process). Thanks, S
Electronics Forum | Sun Oct 03 18:26:17 EDT 1999 | park
What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? How about curing bottom side first and reflowing top side later? What percentage of companies run reflow/cure/wave for
Electronics Forum | Wed Sep 22 10:55:37 EDT 1999 | Craig J.
I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/Pb) a
Electronics Forum | Mon Sep 20 12:19:13 EDT 1999 | Brian
| Hi all, | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. | | We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the S
