Electronics Forum | Tue Aug 05 12:56:54 EDT 2003 | caldon
Hi matt- You describe the board but did not indicate the components being inserted (even there is a part being inserted). Assuming your hole dimensions are ok... Are you cutting and clinching the parts? If so what is you clinch angle? We to have mu
Electronics Forum | Thu Aug 07 15:41:12 EDT 2003 | gdstanton
To further clarify my question. I'm dealing with mixed solder technologies on a single assembly and am curious how the rest of you guys handle this. Do you use lead based reflow profiles or revert to lead free based profiles? If you haven't seen t
Electronics Forum | Thu Aug 07 16:52:49 EDT 2003 | craigj
We've been doing it for quite a while on some parts but are noticing that as more manufacturers are going lead free we are starting to see some issues. Particularily with pure tin on nickel. Have found that need to increase oven reflow temp and time
Electronics Forum | Mon Aug 11 17:42:52 EDT 2003 | Kris
How can one go about defining the complexity of a PCB for characterizing reflow profiles A large balanced board may be easier to profile than smaller unbalanced board ? Any ideas how to define an index to calculate the complexity based on size,weig
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Thu Aug 21 15:50:12 EDT 2003 | davef
Couple of points are: * You're technically correct that ball height has the potential to vary by 8 thou, but we never see that much variation. Ball heights within a lot of components vary just about nil. * When we place BGA, we smush them into the p
Electronics Forum | Fri Aug 22 11:22:40 EDT 2003 | jseagle
When I said partial build I should have clarified that all the boards we build are double sided so the plan is to build the bottom side then build the top side as they are ordered. The bottom will be standard and the top will have the options. I di
Electronics Forum | Thu Sep 04 10:03:13 EDT 2003 | Rick B.
I'm attempting to develop paste in hole process so that I can reflow a few plated through hole components on a mixed tech board. Tried various pastes, profiles and stencil thicknesses. Would appreciate any insights and/or pointers anyone can share on
Electronics Forum | Tue Sep 23 13:00:38 EDT 2003 | Pete
I have seen a few around in PA. Customers seem to like them. Comments I heard was that they're better on smaller components but not so good on large UFP. Mirae (Korean company)is the OEM for the Quad Meridian. Mirae is back with Tyco/Quad for distrib
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