Electronics Forum | Thu May 31 19:45:47 EDT 2007 | diesel_1t
We place a QFP 256 leads 20 mil pitch, had a lot of troubles with shifted components and solderability issues. solderability is not a problem anymore; we solved with a ramp-to-spike profile with .9�C/s 'til 183� then spike to about 118�C, TAL ~60s. W
Electronics Forum | Wed Jun 13 14:48:48 EDT 2007 | rgduval
Is there a sort of standard method to prevent part loss in reflow? I've had a couple of situations come up recently where we've lost some parts during second-side processing. We're running an Heller 1800, with a mesh belt. Most items process fine,
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Mon Jun 25 19:36:36 EDT 2007 | bga_kid
If you calculate CFM using the numbers you have provided you are pulling 1396CFM out of the oven. I am not sure what Hellers spec is but I know a Speedline OmniExcel Air machine should be set at 300CFM. I do know for a fact that to much exhaust can s
Electronics Forum | Tue Jul 03 16:55:57 EDT 2007 | vickt
Amit, You are asking about limitations, but how did you narrow your equipment selection down to the D1 or D2 in the first place? These machines have many limitations versus other solutions. What are your main concerns for instance? Component range?
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Tue Jul 03 10:57:01 EDT 2007 | randomtech
To start, i do not know much about this industry. I am an inventor, and designed an electronic device. I am currently building the prototype myself. I need to find out where i can get this product produced. I would need PCB, component assembly, p
Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Tue Jul 17 09:58:18 EDT 2007 | rgduval
I'd say it all depends on the CM, and how they cost out their production floor. I've seen everything from a flat cost per component placement (something like .05/machine placed smt part, .15/machine placed tht part, .25/hand placed tht part) to stra
Electronics Forum | Tue Jul 24 10:57:12 EDT 2007 | babe7362000
Is there a reason why you want to wash the board > before wave?!?!? > > What is your process > flow? > > I run bottom side of my boards first, > then top just to make it easier to setup (easier > to put those support pins around those smaller
