Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj
You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Tue Apr 03 11:08:21 EDT 2001 | vsorin
Hi, Our engineering board has to decide which technology is better for the hand soldering of the SMT components: HASL or Chemical Ni-Au. We have an automatic line for SMD assembling and our experience shows us that for this automatic line is better
Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
Electronics Forum | Fri Apr 13 14:08:53 EDT 2001 | CAL
Proper setup and cleaning of stencil helps ensure repeatable printing performance. Cleaning processes need to be compatible with materials used in the manufacturing of stencils and solder paste. IPC 7525 should also help you out. We here would Inspe
Electronics Forum | Wed Apr 18 20:55:20 EDT 2001 | davef
Yins are bad, this guy's serious. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically and electrically
Electronics Forum | Mon Apr 23 22:48:50 EDT 2001 | davef
Cal is correct. Sipad, Precision Pad, Optipad, SSD, and all that were a feeble Euroland approach to creating flat pads for fine pitch assembly. To begin with, they required a complete board redesign using their proprietary software. [Oooo, me firs
Electronics Forum | Tue May 01 19:27:37 EDT 2001 | djarvis
I have to say I agree with Dave. The experience in Oz is that OEM's that dabble with EMS tend to go broke. The ones that do survive tend to have big brothers with deep pockets to get them over their lean periods but even they will only put up with so
