Electronics Forum | Thu Jan 29 14:24:56 EST 2004 | rick
What kind of cleaning method you recommend for PCB - double side SMD (fine pitch and BGA components) and THT elements (PCB are for microwave application!!). Process technology no-clean.We have to remove grease-fingerprints, dust etc. It is low volume
Electronics Forum | Mon Feb 02 15:48:00 EST 2004 | billschreiber
Hello Rick, There have been several papers published on the benefits and safety of using ultrasonics for cleaning PCBs. The following are just a few: *B.P. Richards, P. Burton, et. al. "Does Ultrasonic Cleaning of PCBs Cause Component Problems: An
Electronics Forum | Thu Feb 05 08:27:58 EST 2004 | pjc
We had a V-Tek TM30 manual taping machine using heat seal top tape. Had very good results- with skilled operator - to supply taped components to our 2x Fuji IP2 machines - no tape cropping. Stefan's points are somewhat valid, but you can have a succe
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Sun Mar 28 22:17:36 EST 2004 | Grant Petty
Hi, I would also be interested in this thread, but our problem has a different twist to it. We have good results from our reflow with Koki no clean paste, however when we pass the boards through the wave solder machine, the flux in that leaves a fog
Electronics Forum | Thu Mar 25 15:01:45 EST 2004 | patrickbruneel
Why are you guys not simply switching to No-Residue?? Residue free soldering is not a dream, it is a reality and is succesfully implemented for over a decade. I am the founder of no-residue technology, a technology developed to effectively compete w
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Fri Apr 02 16:45:29 EST 2004 | cedams
Ken, You'd think so but the tooling pins only register to the drilling process for the PCB. The fiducial registers to the copper pattern and for both glueing and placing SMT components the pads are more important than the holes. That's why the machi
Electronics Forum | Sat Apr 03 16:39:15 EST 2004 | stefwitt
We had a similar system on the Siemens machines, quite some time ago. However, it was not a laser light but a LED and a fiber cable. Actually the center fiber or receiver was surrounded by a bundle of small fibers for the LED light source. You may al
Electronics Forum | Sun Apr 04 10:16:16 EDT 2004 | cyclopsn
I'm involved in backplane manufacturing process. There are about 10 electrolitic capacitor assembled in my board.These capacitor are soldered using a selective soldering machine. My problem is that these capacitor will charged up and failed as short
winsouce.jpg)
