Electronics Forum | Tue Dec 16 14:48:03 EST 1997 | Justin Medernach
| Q1. | As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. | Ultimately I will be setting up control charts on line. | Does anybody have suggestions in this area ?, I h
Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake
Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Thu Oct 18 18:37:49 EDT 2001 | davef
You�re correct. Probably every supplier�s product has slightly different cure characteristics. Let me spin this up a little differently � There was a slight imbroglio in my office this morning involving a couple of stalwarts and the last Krispy Kr
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Wed Mar 27 07:41:54 EST 2002 | paul_stamper
As Mitchell stated before, the cleaning of the stencil is rather important. When considering stenciling of adhesive you must review your stencil cleaning process. The recomended process is a ultrasonic cleaner with a heater option. These systems are
Electronics Forum | Mon Feb 10 21:19:51 EST 2003 | MA/NY DDave
Hi I am in favor of the best money can buy tiles, and everything including an ESD officier and training for everyone. Long term less money is spent and ESD protection is kept high continually. Boy do I have stories like the cleaning guys who put on
Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef
The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat
Electronics Forum | Thu Jan 29 15:30:41 EST 2004 | pjc
Rick, As I understand your comments, you do not need to clean off the flux residues? Then hot water and a little cleaning chemistry should do. However, there may be some reaction by the residual flux if not enough cleaning chemistry is used. There a
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