Electronics Forum | Fri Aug 12 09:50:19 EDT 2005 | fctassembly
It is true that the SAC alloys are very aggressive to unprotected solder pots but the SN100C lead free alloy can be used in these pots IF they are not already being wetted by your SN63 alloy. FCT Assembly offers a program that includes free tin wash
Electronics Forum | Wed Aug 31 12:24:50 EDT 2005 | Jaya
I have an new product which I brought from another country which I want to do some buz in my country by knowing the product sctructur and copywtite to make the product locally. It is a song player gadget (like transistor player,handheld sizeable).Th
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Thu Sep 15 22:00:17 EDT 2005 | LeeHoMa
hi Stephen, Thank for your comment! Yes! My people also share the same view that customer is asking something which is in more theoretical side. They want us to collect a lot of statistical data to prove our process. Anyway, customer is not only
Electronics Forum | Fri Sep 23 09:25:46 EDT 2005 | Base
Hey Greg, As you already pointed out yourself: unless you can do away with covertape pickup-spools (or can figure out a way to empty them without loosing tension on the covertape) your feeders will not be suitable for several consecutive splices. S
Electronics Forum | Fri Sep 30 03:36:39 EDT 2005 | pavel_murtishev
Good day, 2D inspection requires correct adjustment. In the other case it will cause continuous problems and false alarms. Adjust the lightning first and choose the correct process limits second. Look at histogram when you are adjusting the camera
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
Electronics Forum | Mon Oct 31 14:57:30 EST 2005 | gregp
Hello Rob, So glad you thought of me... Contact Systems policy is--and always has been--free software upgrades for the life of the machine. We do not differentiate betweeen "bug" fixes and added features. Each release is a combination of the two al
Electronics Forum | Wed Nov 16 09:43:39 EST 2005 | Terenzio Facchinetti
Concerning RoHS testing I would like to inform you that a service is provided to achieve compliance by UL: Underwriter Laboratories. Service consisting of (all or each can be requested as stand alone service): - Preliminary investigation (what I ha
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
