Electronics Forum: contaminants (Page 136 of 154)

Solder Pot Volume reducers

Electronics Forum | Thu Nov 13 17:47:00 EST 2014 | warwolf

could always use a potato? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9994&#Message56920 But seriously.. best idea is to stay away from any metal as the tin will likely dissolve and contaminate your solder pot.

Cleaning a Used (Preowned) Selective Solder Machine

Electronics Forum | Tue Sep 15 12:27:59 EDT 2015 | sumote

The key to longevity in any automated soldering machine is in the preventative maintenance. If the machine has had regular maintenance preformed on it, your job will be that much easier. The 1st thing I would do is to either throw out the solder t

What will be the effect of additional solder paste?

Electronics Forum | Tue Apr 19 16:20:05 EDT 2016 | davef

Don't blame it on the poor paste thickness requirement [although I might go on to argue that it's could be a contributor to the issue]. Most likely you're the problem. About 70% of the time solder on gold fingers is caused by poor cleaning of screen

Has anyone heard of a no clean paste that can be cleaned in straight DI water ?

Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous

This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t

Has anyone heard of a no clean paste that can be cleaned in straight DI water ?

Electronics Forum | Thu Feb 01 17:34:45 EST 2018 | Mike Konrad

Thanks for the kind words Dave. At no point in my reply was I trying to sell anything. I apologize to anyone who believes otherwise. I agree with the poster, if assemblies are going to be cleaned, consider a flux designed to be cleaned. While this is

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf

I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p

Lead Lift in QFP

Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar

Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha

Foam in inline wash

Electronics Forum | Thu Mar 21 09:23:35 EDT 2024 | alishakihn

Good morning! I'm sorry to hear about the anomalies you're experiencing with your inline wash. Dealing with foaming issues can be challenging, but I'll do my best to provide some suggestions to help you troubleshoot the problem. 1. Check the Water Q

Re: Ionic contamination

Electronics Forum | Mon Jul 10 21:01:06 EDT 2000 | Dave F

Edmund: Responding to your questions: 1 What is purpose of using DI water to wash a PCBA? Compared to tap water, DI water is less likely to leave: � Metal cations on sensitive components. � Salts of Ca, Mg, and other stuff on metals on the assemb

Re: How to qualify the solder flux of a new vendor?

Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F

Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from


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