Electronics Forum: control (Page 306 of 371)

Re: FR4 vs Ceramic mismatch

Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon

| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event

Just do it but do it right

Electronics Forum | Thu Apr 30 16:35:51 EDT 1998 | Earl Moon

To our dearest Cunli (maybe not dearest to us all), You have provided us with a vehicle to do SMT and PCB's right the first time, on time, every time, at the lowest cost while meeting customer quality and reliability requirements we say is necessar

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 23:59:45 EDT 1998 | Mike C

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: PCB panellisation

Electronics Forum | Tue Apr 07 15:55:37 EDT 1998 | Michael Allen

| I'm also in the "Don't score it" camp. Routed breakaways are much better. If your wave solder process has decent control on the wave height, you shouldn't worry about flooding the boards. | The fine pitch consideration for panelizing - Since you

Re: Reflow soldering a Flexi-Rigid pcb

Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon

| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Fri Apr 10 03:39:50 EDT 1998 | Frank J. de Klein

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Wed Mar 18 22:53:53 EST 1998 | Scott McKee

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Printer troubleshooting

Electronics Forum | Fri Mar 06 10:15:00 EST 1998 | Justin Medernach

| Does anyone know of a web page that provides troubleshooting techniques for the printing process? We aren't experiencing a problem right know but are attempting to set up a reference guide for training. Any help would be greatly appreciated. | Than

Re: Any success using metal squeegees w/Fuji GSPII?

Electronics Forum | Fri Jan 30 14:18:24 EST 1998 | M cox

| | Using metal squeegees on GSPs has caused premature stencil wear. Has | | anyone had any success with this combination? How much snap off did you | | use? We are using .5 mm pitch and have a no clean process. | I have been using lots of metal


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