Electronics Forum | Thu Apr 15 01:29:35 EDT 2004 | pyro747
Hello Everyone, I am having a pin chain speed problem. The speed of the chain will slow down after start up of the oven. Example if you set the conveyer to run at 41 in/min, as the oven warms up of conveyer will slow down phycally but won't chan
Electronics Forum | Fri Apr 16 10:34:29 EDT 2004 | kauer
A couple of questions for You. How old is this oven? Does it have a history of problems? When I have seen speed variations with our Omniflow 7s it is usualy the encoder but it usually spikes rather hard in one spot. You can see this physically and by
Electronics Forum | Fri Apr 16 07:34:10 EDT 2004 | Claude_Couture
Ken, thanks for your answer, it is much better presented than what I was fed by our qc. By "calibrating TCs" I meant the readings the controller is displaying on the screen. So that would be the converter that we would check and calibrate. Thank you
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Thu May 06 18:31:29 EDT 2004 | Dreamsniper
"Polymide Films absorb a great deal of moisture. Polymide laminates must be baked at more than 1 hour at 100'C or better for a double sided PWB prior to exposing the laminate to elevated temperatures such as that required for soldering. Moisture abso
Electronics Forum | Wed May 12 08:16:33 EDT 2004 | solderpro
woow, slow down hot rod, hey davef, you are alright by me, good to see some one out there that has hands on experience rather than a theory nut.... any how, you need a top of the line profiler, super gold mole, or Kic.... these truly are the best and
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN
Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili
Electronics Forum | Fri Aug 06 13:46:20 EDT 2004 | Marcel
Dhanish, on a CP6 if you have skew problems or missing parts begin by a center check on your smalls nozzles. If all nozzles goods, you will have to check the Z zero of the table, this is the pulse count of the z axis (table height) when the turret is
Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef
Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr
