Electronics Forum | Thu Jun 23 05:51:32 EDT 2005 | Paul
Hi Folks, just wondering if anyone else agrees that Rheometric pumps do not work and are more trouble than they're worth. They do not circulate the solder paste properly. The only solder paste that is processed on a FIFO basis is the materia
Electronics Forum | Thu Jun 23 13:50:07 EDT 2005 | Erik
Paul, I'm quite frankly relieved, I thought I was the only one with these thoughts! We have only had our Rheometric pumps since February, but since then our process has been difficult to control with fine pitch applications. And then there's always
Electronics Forum | Sun Jun 26 21:52:15 EDT 2005 | thaqalain
After inserting 128 MB,168 Pin,PC100-222-620 (AZEN RAM)(taken out from another computer) alongside present Kingston KVR133x64C3/128,this data is copied from Systeminfo.txt file and for your kind review/suggestions. Total Physical Memory: 126 MB
Electronics Forum | Wed Aug 03 10:35:06 EDT 2005 | Wonderboy
Wait. I think you need to add that any product sold in EUROPE needs to be lead-free by July 1st, 2006. And let's clarify further. Lead is just one of numerous elements that will be restricted. In fact, quoted directly from the directive: "Member Stat
Electronics Forum | Tue Aug 09 11:57:11 EDT 2005 | Board House
Hi Ted, I am a Sales Manager for a Circuit board Manufacture in MN. We have seen the Majority of our Customer base switch to Enig do to shelf life issues of silver and Tin. Silver, Tin & OSP all have a shelf life between 6 - 8 Mos. Enig is betwee
Electronics Forum | Wed Aug 17 21:58:35 EDT 2005 | plcc
Does anyone familiar with COB process? I hv a PCBA product with one of the photodiode (size 26mmx1mm) which needs to be bonded directly on the pcb using COB technology. The wires that need to be bonded are 2, goldwires for about 100microAmp current.
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly
I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Tue Oct 11 04:08:23 EDT 2005 | Rob
Hi Nuez, We've run a number of different brands of SMT Elco's through a number of leadfree temperature profiles, and consistantly the best performers were Elna & a very similar own brand product (not listing here as it was one from a sister company
