Electronics Forum | Wed Nov 10 21:28:31 EST 2004 | Ken
Yep, just finished a 30 day eval. Way cool stuff. Spendy though. The Gel did not solve all scenarios encountered. But, is a fantastic alternative to rigid tooling. I have many Grid Lok systems. There are pro's and cons to both systems. Overall,
Electronics Forum | Wed Mar 09 12:46:36 EST 2005 | Patrick
MarcA: Could you expand on the results you observed about improved wetting in a nitrogen environment? I am very interested to learn about the impact that nitrogen had. Was there an improvement in the cooling zone with nitrogen? Patrick
Electronics Forum | Thu Feb 03 10:01:08 EST 2005 | Philj
Try heating a blank board on a hotplate to 183 deg C. with a board this thick, if the layer construction is poorly balanced, it may bend enough in the region of the ceramic capacitor for the soldered joints to crack it on cooling to ambient.
Electronics Forum | Sun Feb 13 21:59:02 EST 2005 | Grant
Hi, Cool, and thanks for the info. Can you email us with the costs? I checked out your web site and the lowest cost unit should do the trick for the next year or so. Please email grantpetty@blackmagic-design.com Regards, Grant
Electronics Forum | Fri May 06 10:38:28 EDT 2005 | jimby
Make sure that whoever is pretinning leads are not using a water soluble flux. If they are, make sure parts are being cleaned immediately upon cooling
Electronics Forum | Mon Jun 20 10:44:29 EDT 2005 | ??
I am sure you can reflow lead free in any oven but i thought i read that lead free requires a cooling stage to get the solder joints reflowed "correctly".
Electronics Forum | Thu May 12 08:24:05 EDT 2005 | patrickbruneel
Amejia, If your application is strictly conformal coating and no heat is applied to the board, the product seal and peel would be the solution see link http://www.interfluxusa.com/misc.html This product solidifies immediately on cooling The only dra
Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng
It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.
Electronics Forum | Tue Jun 14 18:32:44 EDT 2005 | GS
Hi Peter, which should be the best cooling rate once belove TAL by using L-F alloy ie. SAC 305 ? Tnks GS
Electronics Forum | Tue Jun 21 14:27:14 EDT 2005 | Dreamsniper
Defects will result, Your cooling rate is affected because the hot air is not circulated properly. Outgassing will appear and you'll have pin holes / blow holes, disturbed joint etc. Correct me guys if i'm wrong. Thanks
