Electronics Forum: cooling (Page 31 of 99)

Boards getting

Electronics Forum | Tue Aug 02 23:02:04 EDT 2005 | crishan

Assuming it is not PCB supplier related, here are my thoughts; 1. CHK Component density top / bottom, I am assuming you do bottom reflow first then top. If have alot of heavy comps on bottom it might cause the board to sag in the middle. 2. You hav

X7R woes

Electronics Forum | Wed Jan 04 13:47:11 EST 2006 | russ

To answer your question it was mentioned that allowing the boards to cool slightly between reflow and wash may help this case to eliminate thermal shock from immediately going into colder water straight out of the oven with no cooling. In looking at

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Fri Feb 24 10:33:13 EST 2006 | MikeL

I know what you mean. Saw this in systems where cooling was not done through the reflow nozzle (i.e. PACE). What happens is that as you run 1-2 profiles, the metal parts along the pathway of the hot air (before it comes out of the nozzle) act as he

Reflow oven

Electronics Forum | Mon Apr 24 04:23:56 EDT 2006 | TA

Hello guys, I am Looking for a oven with the following specifications. Can any one suggest me the best suitable model. Thanks ========================================================== - heating length 2500mm - zone top/bottom 7 - forced convection

Functional Test Faulure due to BGA ICs

Electronics Forum | Fri Jul 21 16:47:17 EDT 2006 | stepheniii

Does replacing the BGA fix the problem? To be a little more blunt, is the BGA or is it the tech says it's the BGA. Beleive none of what you hear and only half of what you see. What kind of BGA is it? If it is one of those BGA's with a built in heats

Lead free parts on a leaded assembly

Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE

Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap

detected swarf particles on minimelf

Electronics Forum | Tue Jun 26 20:51:44 EDT 2007 | davef

You're correct. In the metal working industry, it's common to discuss swarf. For instance: Swarf is a mixture of small metal particles, cooling fluids, lubricants, and residuals from grinding media such as abrasive belts or stone wheels. Swarf is ty

surface mount connector, disturbed solder

Electronics Forum | Mon Apr 21 11:55:29 EDT 2008 | realchunks

"Disturbed" usually means some form of movement. I would think your leads are moving due to warp as the board exits the reflow zone. Not knowing your profile, I would suggest checking your profile. Make sure you have adequate "above liquidous" and

MPA III Power source

Electronics Forum | Wed Jan 21 10:27:27 EST 2009 | gidster

Ok. As you know the machines changed a bit after > 95 due to CE regulations. > > There are no drawing > on board/box level in Panasert > machines. > > However normaly i`ts the 100 volts > thats "shorting out" the machine and shuts it > down. C

Real power consumption of Heller 1707

Electronics Forum | Sat Dec 17 16:46:45 EST 2011 | eadthem

Startup current depends on your configuration. ours dose zones 1,2/ 3,4/ 5/ 6,7 last i checked it pulled about 40-55 ish on start up and 25-35 during run. our profile is a slow ramp till 170c then a fast ramp to 285c 280c(last 2 zones). 1707's


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