Electronics Forum | Fri Feb 25 15:08:30 EST 2005 | jdengler
John, We tape (usually high temp tape) flex to a fixture (usually 0.090" piece of bare FR4). We make an outline on the fixture to get a rough location then use fiducials on the flex for alignment. Print, place, reflow, cool, remove flex. When the
Electronics Forum | Tue May 24 05:25:17 EDT 2005 | Zsolt
We had similar problem, the root cause was that the cooling fans on the VME rack were not working and the vision card hangs up if the temperature is too high. Also check the power supplies, we had also a problem that the filter condensator inside the
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Tue Jun 21 16:54:37 EDT 2005 | slthomas
I'm inclined to believe along with others that if you don't smell it, and the flow rate is consistent (hence, your profiles aren't suffering from fluctuations in temperature due to fluctuations in circulation) you're probably OK. It does beg the que
Electronics Forum | Wed Jul 20 01:44:51 EDT 2005 | Ron
Hello!! Where can I find some materials and information about temperature testing?? We have a new temperature testing chamber and i would like to know how fast product will cool down and after that how soon can I put this product to high temperature
Electronics Forum | Wed Aug 03 21:20:09 EDT 2005 | Ken
CTE mismatch. X, Y, Z all expand at different rates. Cooling or heating rates will not change this CTE mismatch. Layer counts, power plane ballance, equal run lengths in x-y and copper balance all contribute. Have your supplier evaluate your s
Electronics Forum | Tue Sep 27 19:59:17 EDT 2005 | Alan
Contact your solder supplier and ask if you can borrow the moulds that they use when they cast the solder. We have done this before to empty one of our wave solder pots. We didn't have to coat the moulds with anything at all, just fill them up, cool
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Fri Nov 25 12:12:46 EST 2005 | pjc
To state whether an oven can or cannot "do lead free" very much depends on what type of product you need to solder. High thermal mass products are problems for 4 and 5 zones ovens becauase they typically cannot follow the solderpaste mfrs. profile, u
Electronics Forum | Fri Feb 24 21:30:17 EST 2006 | sessioc
We just installed 2 YESTech 2050's for our 2 lines and I'm extremely happy with them. Our machines are setup inline post reflow w/ the capability of diverting good/bad boards utilizing Nutek's t-type turn unit. Of course, we all know that the objec
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