Electronics Forum: crack (Page 1 of 95)

Plating crack

Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan

What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul

solder crack

Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary

the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2

solder crack

Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc

Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos

solder crack

Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef

Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di

ceramic cap crack

Electronics Forum | Sat Jun 19 08:32:49 EDT 2010 | davef

Please describe the location and appearance of the crack

MLCC crack detection

Electronics Forum | Fri Sep 03 11:28:18 EDT 2004 | KenF

Fine crack in multi-layer ceramic capacitor (MLCC) may not be detectable by capacitance check.Could anyone out there advise which is the most appropriate method to test/detect fine crack ?

ceramic cap crack

Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o

Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com

lead free solder crack

Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai

I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T

ceramic cap crack

Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o

Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea

BGA Straight crack

Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f

Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee

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