Electronics Forum | Thu Jun 22 15:50:53 EDT 2000 | Dave F
Lee: Here is two materials related questions: Taking a long term view, how are preferred materials selected from a design for the environmental perspective? What are the criteria for determining if a material is recyclable? Who does this?
Electronics Forum | Tue Jun 12 13:53:43 EDT 2001 | Eliud Rivera
We are trying to quilify a No-Cclean solder paste and we would like to know what kind of criterias or measurments are use to qualify the amount residues? Can we use an omega meter for that? What equipment measures SIR?
Electronics Forum | Tue Jul 03 07:02:28 EDT 2001 | Mike
Hi all, I would like to set up specification for inspection adhesive after printing. Does any one has some recommendation, what parameter/criteria should I look for. Thank you.
Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Fri Jun 26 19:02:09 EDT 1998 | Rin Or
I am very interesting of getting information about the criteria inspection of BGA. Example, what are percentage allowance for void, solder joint volume etc.. Any information feed back will be greatly appreciated.My factory just install the Nicolet NX
Electronics Forum | Wed Jan 14 08:24:07 EST 1998 | Allison
Good luck in your conquest. I have been struggling with the same issues for some time now. I have made the following conclusions. First, it is nearly impossible to establish parameters in SMT to perform X-Bar and R charts. Electronics is not as cl
Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand
Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y
Electronics Forum | Mon Dec 31 05:14:58 EST 2001 | ronih
Hello, Are there any rules for PCB drying (baking) before assembly; Date code criteria, finish process on PCB, storage conditions.. ect. I know some assemblers that are baking all PCB (not ENTEK!) as default before assembly, is it realy nessesary? i
Electronics Forum | Fri May 31 09:13:12 EDT 2002 | russ
Jim, you are right in this. these connectors have long pins 1/2" or so that protrude through the board and are used for mating into a female connector on some other assembly. due to both length and "no solder allowed in contact area" criterias thes
