Electronics Forum | Thu Oct 15 14:35:44 EDT 1998 | Joseph Belmonte
Hi Folks, As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process? Are
Electronics Forum | Wed Nov 08 08:48:45 EST 2006 | markhoch
Okay, here's the deal-e-o....I need to find the Nation's Best BGA Rework Specialists. I have 50 PCBs each measuring about one square inch, that need to have a BGA Ring Socket Removed, eight capacitors removed, and a new ring socket installed. Sounds
Electronics Forum | Mon Jul 17 08:01:02 EDT 2000 | lh_zeng
Hi guys, I need to purchase x-ray system & rework station & Solder Paste Inspection and Data Analyser for BGA,CSP,QFP, etc. in other word, multifunction for future requirement. But I have no ideal about how to choice a product. Maybe somebody is wil
Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
Electronics Forum | Thu Apr 20 13:02:44 EDT 2000 | Robert Patrick
Hi.... I read your message and can empathize. I just joined PDR Infrared Systems. PDR offers an Infrared System for CSP/UBGA with X-Ray or Optical Inspection Packages. You may want to consider IR technology for UBGA before taking the plunge. Hop
Electronics Forum | Fri Aug 24 09:38:17 EDT 2001 | gerits
Hi, you can use the Assembleon (Philips) ACM Micro for this. It can place Flip Chip form 0,1x0,1mm upto micro BGA, CSP's etc. etc. It even can handle Odd's and insert components. Web-site http://www.assembleon.com Please contcat me or our company o
Electronics Forum | Fri Aug 10 19:49:32 EDT 2001 | nifhail
What would be the best method for attaching the balls, when doing BGA rework. I Found that by using the solder paste, it will give us better rework yield vs using the paste flux ? My data was collected from a very small experiment and hard to conclud
Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F
Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl
Electronics Forum | Thu Jan 03 02:35:18 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
Electronics Forum | Thu Jan 03 02:36:04 EST 2002 | ianccy
Hi, I am trying to write SOP about the baking requirement of some CSP and uBGA components, the label on the packing said its usable within 72 hours and follow the MSL 4 condition, what does the MSL means? is it Material Safety Level? Has anything to
