Electronics Forum: cu osp on leadframe (Page 1 of 1)

Info on OSP PCB�s

Electronics Forum | Tue Apr 22 14:53:22 EDT 2003 | Robert

OK...I'm hooked on this subject. Were changing from NiAu to OSP as a "savings" and not because we choose too. So far we have had great success with BGA and are working on TSOP, SOP, etc. The only thing we have come to dislike so far is the ring aroun

Info on OSP PCB�s

Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef

You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t

Info on OSP PCB�s

Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach

I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the

Copper Oxide Thickness Measurement on PCBs

Electronics Forum | Fri Sep 03 04:00:10 EDT 2010 | sachu_70

James, Are you referring to oxidation caused on outer layers of PCB on account of poor OSP finish over Cu?

Poor Solderability on TSOPs with Alloy 42 Leadframes

Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak

Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R


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