Electronics Forum | Tue May 07 10:50:18 EDT 2002 | Brian C
Looking for some direction from you folks in regards to finding water jet (or similar) depanelizers. Currently, we have the pizza cutter style depanelizers (which work fine) however some issues are coming up concering fracturing of ceramic chip cap
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Tue May 14 14:18:56 EDT 2002 | dason_c
Recently, our customer request us to use the N2 dry cabinet and we are currently using the desiccant type dry box. My concern not only the cost. Is it any data to show if the component exposed to the floor for a while and store back into the N2 cab
Electronics Forum | Wed May 29 15:44:59 EDT 2002 | Jacob Lacourse
Hi, All Our board design requires us to selectively plate some connector pads with gold. The problem is we have changed board houses and they charge a heafty amount to mask the rest of the board. One option is to allow them to plate the whole bo
Electronics Forum | Wed May 29 19:17:17 EDT 2002 | russ
We are starting to see a large increase in the use of through board gold plated connectors that require hand soldering with the limitation of .o6" encroachment up the pin. What is the best way to accomplish this? we currently scrap about 5-10% of t
Electronics Forum | Fri Jun 07 17:27:50 EDT 2002 | nuezmaster
I am having some diffuculty convincing our exec. staff that by increasing our personel on the floor, we will actually improve our machine efficiency. We currently have seven lines, four of them have two P&P machines in line. At this point there is
Electronics Forum | Wed Jun 19 18:41:52 EDT 2002 | nuezmaster
Our plan right now is only to increase production on the products that we are behind on. Since we are currently running three shifts with seven assembly lines and only adding six people (3-Days, 3-Nights), it averages out to about a 20% increase ove
Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi
We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump
Electronics Forum | Thu Jun 13 15:43:19 EDT 2002 | mjabure
The major draw at NEPCON was the the machine manufacturers. With most of the big players going to the APEX shows, NEPCON attendance has seemed to slow down quite a bit. Although APEX wasn't very busy either. With the industry in it's current state no
Electronics Forum | Wed Jun 19 22:03:23 EDT 2002 | davef
If you can assemble flawless products with these boards, do not be concerned about post-assembly quality issues. There is no current related specification in the US. Although, there may be some old military specifications that apply, but you would
