Electronics Forum | Wed Nov 19 18:43:04 EST 2014 | gregcr
Hi All, I've been in the CM world for a long time and it seems like there has been little change in the packaging techniques used at the end of the day. Assembled circuit boards in small/flex volume are bagged or bubble wrapped and boxed up to ship
Electronics Forum | Tue Dec 23 12:34:27 EST 2014 | deanm
I'm sure you considered acquiring a second FX-D and run them inline, the first dispensing half the board and the second the other half. That would automatically double your throughput. You wouldn't have to worry about a new process, consumables, et
Electronics Forum | Thu Feb 12 12:22:04 EST 2015 | barryg
Thanks for your input Rob, Our operator does not profile pcb's which so far we have not had issues that could be attributed to his oven settings. We may be running a pcb with a BGA on it and I was concerned about our lack of profiling. I have spent q
Electronics Forum | Thu Feb 26 03:43:08 EST 2015 | 3dpcb
Firstly thank you for your time and consideration. Yes a professional device along the lines of the products seen on kickstarter. A system to be used by labs, R&D, product development centers etc. The difference from current offerings being resistivi
Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
Electronics Forum | Thu May 14 16:09:49 EDT 2015 | hottchkisu
Hi All, > > On occasion we see components that > have gone through pick and place and are slightly > misaligned. Currently, operators manually adjust > these misaligned components to prevent reflow > failures. However, I am wondering if this >
Electronics Forum | Thu Jun 04 07:54:53 EDT 2015 | frix
Good day, Thank you very much for the response. We are currently running 0603 and larger. I don't think there is any components that got into the head. I've been reluctant to open up the glass encoder of the head - it seems that a lot of the parts
Electronics Forum | Tue Jun 02 17:32:53 EDT 2015 | jldowsey
Les, Some of the answers to design or stencil aperture/placement machine depend upon what is the current spacing between your components which you didn't specify. Chip components such as 0402's and 0201's typically have very small reductions in pas
Electronics Forum | Fri Jul 10 15:28:47 EDT 2015 | sumote
I could really use some help, My oven is continually blowing one of the SFC fuses (the one on the left as it sets in the machine) when the conveyor tries to run. It appears that the traces on the circuit card were having too much current pulled th
Electronics Forum | Sun Jul 26 07:09:25 EDT 2015 | orbitcoms
Thank you for your prompt response. The boards we have made for us current are Immersed Gold treated because we have been hand soldering and needed flat finish that would solder ok without tarnishing too quickly. I will take a look at the link you pr
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