Electronics Forum: current (Page 301 of 378)

Re: SMT/TH machine programming

Electronics Forum | Fri Sep 03 00:17:21 EDT 1999 | JAX

You use MCS computers to transmit programs/data to machines | | --> MCSs are getting old, so you would like to use F4G or FujiCam just because you could use a standard 486/Pentium | | --> But you still like your current programming SW (obviously not

Re: Help for CSP Prototyping

Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma

| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p

Re: Help for CSP Prototyping

Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon

| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t

Re: Electroless Tin Plating

Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F

0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren

Re: REFLOWING WHITE TIN PLATED PADS

Electronics Forum | Wed Aug 18 11:52:35 EDT 1999 | Brian

| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.

Re: pcb design for bga grounding.

Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn

| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground

Re: pcb design for bga grounding.

Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare

| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the

Re: Pick N Place UPS

Electronics Forum | Mon Aug 09 19:03:07 EDT 1999 | ScottM

| | Greetings, | | | | Would like to buy a 3 phase UPS for our Mydata TP11. | | Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? | | Called Mydata and suggested 2.2KVA per pha

Re: Pick N Place UPS

Electronics Forum | Wed Aug 11 23:55:19 EDT 1999 | Dean

| | I appreciate you're input on this, John, Scott. It's a neat thing Mydata did with the power out, status saved feature. That comes in handy a lot down here. | The problem is with our machine, however, "I think", is that we have one of our phases

Re: Parts Packaging Data

Electronics Forum | Thu Aug 05 04:32:21 EDT 1999 | Wolfgang Busko

| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.


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