Industry Directory | Consultant / Service Provider / Manufacturer
The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.
Industry Directory | Distributor
Sales & Service of PCB Test & Inspection Equipments LIke Agilent AOI, ICT , XRAY, Dage XRAY
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Electronics Forum | Fri Jan 16 16:32:09 EST 2015 | hudson187
I was wondering if anyone out there had the re-install discs for a Dage Nordson XD6600 X-Ray system and would be able to image them and send along; the unit is no longer supported by Dage and my discs are MIA.
Electronics Forum | Tue Jan 29 22:01:51 EST 2008 | davef
These test are largely useless. Check the fine SMTnet Archives for previous rants. Manufacturers of machines to use are: * Peel tests: Instron [Instron Worldwide Headquarters; 825 University Ave, Norwood, MA 02062-2643; 800 877 6674 http://www.inst
Industry News | 2014-05-22 15:42:29.0
Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.
Industry News | 2016-03-22 17:01:09.0
BajaBid Europe announces that they will be hosting one of Europe’s Largest Online Electronic Manufacturing Equipment Auctions on 29th – 31st March. The Auction has over $1 million of surplus equipment.
Parts & Supplies | X-Ray Inspection
DAGE XD7500VR for sale vintage 2010 please contact for more infomation
SENSOR MAGNETIC 4PIN E-LINE,Board Mount Hall Effect / Magnetic Sensors 12V 4Pin E-Line Magnet Field Sensors Price: - Quantity:Stock : 356 Minimum :1 Manufacturer :DIODES Datasheet : ZMZ20M PDF Package/Case : SIP
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2015-01-05 17:38:26.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
The X-Plane™ option uses a proprietary, patent applied for, tomosynthesis (or CT) technique to create 2-D X-ray slices in any plane of a printed circuit board assembly without the need to cut or destroy the board. In this way, the superior image qual
Career Center | Fremont, California USA | Production,Quality Control,Technical Support
Local EMS manufacturing leader is looking for several SMT Operators Quality. Will be conducting visual inspection for PCBA SMT quality, AOI operation, AOI defects verification, test board & 1st article inspection, 2D X-Ray/Dage operation, and end of
Career Center | Racine, Wisconsin USA | Engineering
Cree currently has a job vacancy for an SMT Process Technician in our Lighting Manufacturing facility in Racine, Wisconsin. Summary: This person will be a primary contributor to the startup of a new SMT production line for LED PCB Assembly. This
Career Center | Timisoara, timis Romania | Engineering,Maintenance,Technical Support
Working as a service engineer at ICCO EMT for more than 10 years experience in service activities in Eastern Europe for pick and place systems from Assembleon starting 2000 in all major EMS sites, beginning 2006 involved in evaluation (first system o
Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries
Industry | Nordson DAGE X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
Baja Bid | https://bajabid.com/product-tag/dage/
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