Electronics Forum: dave (Page 161 of 327)

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.

Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i

Re: Shelf Life of Components

Electronics Forum | Fri Dec 03 18:01:39 EST 1999 | Dave F

Chris, Two points of perspective are: 1 Solderability: The shelf life of components has elapsed when they are no longer solderable. There's tons of variables that affect this, but keys are: * Intermetalics grow as a function of temperature. * Th

Re: SMT Zero-defect Soldering

Electronics Forum | Tue Dec 07 22:25:45 EST 1999 | sin

Dave, the zero-defect is impossible through my understand in a high volume or proto run manufacturing. Base on theory i have read, yes of course it should be. but practical side of view, it is impossible. you are talking about plenty of variable to

Re: SMT Zero-defect Soldering

Electronics Forum | Wed Dec 08 18:11:22 EST 1999 | Dave F

sin: You're correct, there is no defect reduction program that's perfect, in fact nothing is perfect!!!! That's why people talk about 6 sigma and not 20 sigma!!!! If you had a perfectly controlled process, you'd still have defects due to random va

Re: Alphametal stanardizing solution

Electronics Forum | Wed Nov 17 11:48:12 EST 1999 | Dave F

Larry: Cookson spun Alpha's instruments (omegameters and such) into its specialty coatings group, you know with Paraline and all that. Makes sense to me. Of course, I don't connect with the whole Cookson approach anyhow, but they have money and th

Re: High Tg laminates

Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F

John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th

Re: patches

Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F

Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u

Re: x,y digitizer and optical comparator

Electronics Forum | Thu Nov 11 20:33:05 EST 1999 | Dave F

Michael: DIGITIZING BOARDS Yech!!! ScanCAD 303.986.7707fax7631 makes a Xerox copier-like thing to copy your board. But why not consider: 1 There are service bureaus that will scan and convert your boards. 2 Why don't you get the gerber data fr

Re: x,y digitizer and optical comparator

Electronics Forum | Wed Feb 13 17:33:07 EST 2002 | Sheri Connor

Hi Dave, I wanted to make sure you have current contact information for us: ScanCAD International, Inc. PO Box 598 19181 Hwy 8 Morrison, CO 80465 Phone: 303.697.8888 Fax: 303.697.8580 Not only do we sell our scanning systems, we also have a Serv

Re: Conductor width tolerances

Electronics Forum | Tue Nov 09 11:32:32 EST 1999 | Dave F

Wolfgang: "Our desire is to get what we design" ... Wanting to get what you ask for ... ummm sounds like a risky proposition!!! ;-) Two things: 1 Go to the Hadco site and get their "boiler-plate." Use it and some of the Earl Moon specs in the SMTn


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