Electronics Forum | Fri May 17 10:53:15 EDT 2013 | davef
ENEPIG or Imm Pd? Concerns about palladium as a solderability protection are: * Palladium is more difficult to process in fab than gold * Palladium solder alloys can be brittle, similar to gold, without proper soldering process and/or specification/
Electronics Forum | Thu Sep 05 22:36:38 EDT 2013 | davef
Yes, providing your: * Inbound material does not compromise your process. * Soldering processes apply the proper amount of flux and activate it properly * Material handling does not contaminate your boards Recognize that the IPC requirements of less
Electronics Forum | Thu Sep 05 21:58:24 EDT 2013 | davef
Both SN100C and SAC305 are excellent and tested LF alloy formulations that with proper process management will produce good looking and reliable solder connections. "Bright & shiny" solder connections is NOT a good measure of a properly soldered LF c
Electronics Forum | Sun Sep 08 18:06:30 EDT 2013 | davef
Protect the board: If solder mask protects the board, the level of protection is limited and inconsistent. If you want protection, you need the be thinking conformal coating. Selective ENIG: I believe the reason solderability protection, except mayb
Electronics Forum | Mon Sep 09 18:10:35 EDT 2013 | davef
I don't know, but here is a link to a paper from the fine SMTnet Technical Library on a similar topic: http://www.smtnet.com/library/files/upload/Wire-Bonding-and-Soldering-on-Enepig.pdf Contact the authors and ask for their advice and help. BR, d
Electronics Forum | Fri Jan 24 15:46:29 EST 2014 | davef
Graping is caused by a lack of flux when the oven reflows the paste. Read [“Best Practices Reflow Profiling for Lead-Free SMT Assembly” Ed Briggs and Ronald C. Lasky, Ph.D., PE, Indium Corp] http://www.smtnet.com/library/index.cfm?fuseaction=view_ar
Electronics Forum | Mon May 05 21:31:07 EDT 2014 | davef
Peter is a long-time participant in the Forum. Seven or eight years ago, he started the YahooGroup for Zevatech / Juki users and grew it to 70 - 80 users. When his company moved to Assembleon machines, he turned the management of the Zevatech Group t
Electronics Forum | Tue May 06 21:24:28 EDT 2014 | davef
Most ceramic you'll see comes from Coors or Kyocera. Size of your substrate will vary according to the stencil / component that you're using. 3" by 3" should be sufficient for most applications. If you get them too small, you could have handling is
Electronics Forum | Tue May 06 21:35:27 EDT 2014 | davef
Indium recommendations: 0201's: * Stencil Opening = 11mil x 16mil rectangle * Foot Print = 12mil x 15mil rectangle * Stencil Thickness = 5mils * Spacing = 9mils Note: The most common stencil being utilized, is the laser cut electropolished, and in so
Electronics Forum | Sat Aug 22 16:16:13 EDT 2015 | davef
Comments are: * Read “Challenges for Step Stencil Printing” [Carmina Lantzsch, Georg Kleemann, LaserJob GmbH] http://www.smtnet.com/library/index.cfm?fuseaction=view_article&article_id=2096 * I want to say that IPC7525B [Oct 2011] improved the dis
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