Electronics Forum | Thu Apr 14 05:20:58 EDT 2005 | aj
All, I am considering trying out the above to try and eliminate some of my defects on the wave process aswell as reducing cycle time etc. Incase of unfamiliarity with what it is : basically there is a Solder Preform present on the Header/Connector a
Electronics Forum | Tue Jun 14 11:25:19 EDT 2005 | pr
Sounds a little tough to achieve. Math isn't my strongsuit but...If you run a million parts through the machine, you will have 200 feeder exhaust's (assuming 5000 per reel). So if you have your machine error out after 3 attempts/misspicks you will ha
Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken
Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in
Electronics Forum | Wed Aug 10 13:32:46 EDT 2005 | stefwitt
Unfortunately, I couldn�t get any money back from the dealer. I fear there are not many dealer, who would pay back. In respect to all the other dealers, who prefer to provide quality products and repeat business, I would like to mention, that follow
Electronics Forum | Tue Aug 09 13:58:24 EDT 2005 | Cmiller
I saw a Mydata demo and it seems like it would be pretty easy to pull a magazine back a few inches then tip it up into the head. I assume this would cause catastrophic damage. I was told this has never happened in North America. Which means it must h
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev
Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter
Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly
Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de
Electronics Forum | Wed Dec 14 12:57:23 EST 2005 | grantp
Hi, Wow, that's cheap. I did not know they were available that low cost, and we had been quoted much higher for the Ursa scope, so that's why I thought why bother, and lets put it into xray. I bet Superman would have a terrible time working in an S
