Electronics Forum | Fri Sep 05 19:56:56 EDT 2008 | hegemon
We did extensive side by side (by side) testing of three AOI machines Omron, YesTech and Mirtec. In the end, even with weighted scores, the difference in the top two machine was still only four/tenths of a point. Third place was a distant 14 points
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Mon Jan 12 12:43:34 EST 2009 | smt_guy
With the High Volume Manufacturing in United States became lesser and the current crisis that the country is dwelling in, Low to Medium Volume - High Mix Manufacturing is very common and small EMS Providers are scrambling to get a Pie of the Job. I
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
Electronics Forum | Mon Sep 21 04:23:16 EDT 2009 | smtbox
R series Features FCS (Flex Calibration System) highly regarded easy maintenance just got even easier! The optional FCS calibration jig is a simple to use system to re-calibrate placement accuracy. The machine automatically picks and places jig comp
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Thu Feb 18 18:25:33 EST 2010 | tony_d
Hello Bryan, My recommendation is MIRTEC by far. We checked out several machines and narrowed the selection down to two, YESTech and MIRTEC. We had an opportunity to work with both of these machines on our production floor. We found that the MIRTE
Electronics Forum | Tue Mar 23 10:46:48 EDT 2010 | oeidave
Hello Sibbe, Thank you for posting your questions. There are a few approaches to AOI with the majority being program driven. There are a couple of systems that are simply comparative in that you use the system to compare a golden board to others th
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