Electronics Forum: delamination growth (Page 1 of 1)

Re: Reliability of coated Plastic encapsulated Microcircuits

Electronics Forum | Wed Jul 22 16:00:24 EDT 1998 | David A. Pinsky

Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? We have performed failure analyses on PEM's in our lab for many years. The vast majority of pa

Re: MI Solder temp & RF routing

Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What is the con

Re: MI Solder temp & RF routing

Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What

BAKING MICRO BGA BOARDS AFTER REFLOW AND WASH

Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken

If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias

Vacuum Bags

Electronics Forum | Wed May 16 16:34:09 EDT 2007 | aj

"Usually people use the vacuum to remove air and then replace with nitrogen to eliminate oxidation and a medium for bacterial growth. Why anyone would need to vacuum pack a pcb is beyond me, though. " We might get a batch of 400 pcbs in but the kit

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

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