Electronics Forum: design guidelines (Page 31 of 32)

How to PROPERLY interpet a supplier's paste profile documentation & specification?

Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef

I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd

I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we

X-RAY

Electronics Forum | Fri Jan 12 09:04:18 EST 2007 | Cal

For insurance purposes we verification... Here is a snippet from Glenbrooks website. From http://www.glenbrooktech.com Design Safety Standards The design safety standards pertaining to Industrial X-ray Inspection Systems can be found in "Code of

Re: Shelf Life of Assemblied PCB's

Electronics Forum | Wed Aug 04 12:35:15 EDT 1999 | Dave F

| | | | I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone kno

Re: Screen printing glue for wave soldering SMT components.

Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal

For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o

ECOs on OSP finish

Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef

Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c

Re: Rephrase : mixed technology criteria.

Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F

Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to

Re: Hot air knif in wave soldering

Electronics Forum | Mon Sep 28 10:12:53 EDT 1998 | Chrys

| Hello, | I need some users information about "Air knif" in wave soldering: | 1. Does it decreases bridging ? | 2. Is it self installed of a purchesed kit (if purchesed, who are the recomended vendors) ? | 3. Any other information about the issue. |

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

Solder Balls in Boards

Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324

Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,


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