Electronics Forum | Fri Sep 11 08:36:22 EDT 2009 | leemeyer
Thanks Boardhouse, This looks like it will work. Unfortunatly the free version does not pinpoint the violations but it does let me know that they exist somewhere on the board. It's a relatively inexpensive upgrade to get the version that will pinpoi
Electronics Forum | Thu Sep 10 11:47:44 EDT 2009 | mikesewell
The adhesive should be a dielectric (insulator) by design, if not it could possibly short across leads of the very parts it's intended to secure. It normally isn't a concern - what is the surface resistance of your soldermask, bodies of ICs, ...etc.
Electronics Forum | Fri Oct 23 16:54:02 EDT 2009 | pnguyvu
FOR YOUR NEXT RUN CONTACT STEVE @ USA STENCILS INC, HE WILL MAKE ONE SAMPLE FOR YOU - THEIR TEAM HAVE SOLID EXPERIENCE IN STENCIL DESIGN ESPECIALLY PCB WITH CRITICAL COMPONENT. HIS EMAIL IS STEVE@USASTENCILS.COM GOOD LUCK!
Electronics Forum | Tue Nov 24 23:55:58 EST 2009 | henry_usa_stencils
You can order the glue stencil at http://www.usastencils.com They can design the opening of the apertures on the stencil in the middle of the caps so you can screen an adhesives through the opening then you will have it right on the center of the cap
Electronics Forum | Thu Nov 19 01:56:01 EST 2009 | lococost
Thanks dave, We have our problem down to the stencil (printer). We are unaware of any design rules concerning aperatures on glue stencils, does anyone know of any?
Electronics Forum | Thu Nov 12 09:26:23 EST 2009 | cellis
Actually not true. We are the official distributor for the T200 ovens for the US. Some of the other ovens on our site are exclusively manufactured for Manncorp with our input on design. Regardless of any product we sell, whether distributed or our
Electronics Forum | Mon Dec 28 14:51:06 EST 2009 | spitkis2
That's not going to work in this case. The substrate has very small pads designed for a micro BGA die. Thanks for the suggestion though.
Electronics Forum | Mon Jan 11 16:06:48 EST 2010 | propox
Hello I have cad2cad, I do not have PPSPro, we have P@P file from Altioum designer as an input and now we have to generate file for machine, can You help us?
Electronics Forum | Mon Jan 18 15:07:12 EST 2010 | mikesewell
Usually the print specifies the material since the design is qualified with it in place. I've used several from Scotchweld 2216, Scotchweld DP190, Hysol E-20HP, to NASA outgassing qualified Masterbond 10HT.
Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
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