Electronics Forum: design (Page 31 of 537)

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef

First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff

BGA ball vs land design problem??

Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0

Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan

Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref

How to optimize the PCB design layout on CAD packages?

Electronics Forum | Wed Nov 16 11:30:20 EST 2005 | nkbkiran

If PCB board size is my constraint ....and I have designed my circuit ... 1. How to optimize the layout of design for smaller space? 2. How to run simulations if any to do intelligent SI test? Does packages by Cadence, Mentor support this kind of o

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Tue Mar 24 10:34:03 EDT 2020 | slthomas

My experience with our process is that those parameters would result in a big bridging problem. I'm working with a stencil designer at our fabricator on an asymmetrical aperture design that hopefully balances forces enough to keep the parts centered.

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of

PCB software choices for a beginner in PCB design field

Electronics Forum | Mon Oct 30 03:30:34 EDT 2017 | wendymm

Finally, I chose AD to finish my design,and I thihk it's really fit for beginners.

Is there a Selective Soldering board design IPC standard?

Electronics Forum | Tue Mar 01 16:36:43 EST 2022 | joshsvoboda

We are fairly new to selective soldering. I would like to find out if there is an IPC PCB design standard to allow for selective soldering.

VSSOP 0.4 mm Pitch pad design & Stencil aperture

Electronics Forum | Mon Dec 18 21:17:41 EST 2006 | davef

Use the IPC calculator [free at http://www.ipc.org]

Thermal Relief BGA footprint design - traces - reflow

Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator

If only my company would pay for a membership to IPC......


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