Electronics Forum: design (Page 321 of 537)

Pb Free Voids

Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas

There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here

SMT on Flexible circuits

Electronics Forum | Thu Feb 15 20:27:11 EST 2007 | vshan

Hi Chris Good Day!!!! well we are running flex panel(150x270) with one connector(3 pin legs both sides) insert. Each panel consists of 28 parts and its used for disk drive industries. We are having a pallet to support with the top cover design such

SMT on Flexible circuits

Electronics Forum | Tue Feb 20 20:40:03 EST 2007 | vshan

Hi Chris Good day!!! could you please let me know what kind of basket yu r using. Currrently we are using 30 by 40cm stainless steel carrier. Top n bottom design with square type. The area of connectors are open so that the water hits the connetor d

ICT bare board

Electronics Forum | Mon Mar 12 03:41:25 EDT 2007 | tanemmirt

i designed a new product; i want to produce it in china, so they requested the ICT to be done; i have 03 questions if some one can help me on: 1� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? 2� testing

Thermocouple Design

Electronics Forum | Sun Mar 25 15:38:07 EDT 2007 | Gibbon!

Couple of things. Type T thermocouples are solder friendly. However usually a header with screw terminals poses no problem as the temperature differential is nil. Getting thermocouple leads wet causes problems because two dissimilar metals + condu

LGA36 6.5 x 3.5 mm

Electronics Forum | Sun Apr 15 19:55:52 EDT 2007 | darby

Mika, I think you will find all board houses "clean up" their customer's files to suit their shop. Depending on the severity of the change; I think they take the attitude that they will not inform you to avoid an argument going backwards and forwards

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef

UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n

How long can you leave paste - update

Electronics Forum | Mon Apr 02 10:46:03 EDT 2007 | slthomas

Hand up here too. While most pastes have some flexibility and you may get by without too many problems, I don't think any of them are designed with long wait times in mind. What I'm confused about is what your operator is doing when boards ARE runni

SMT fuse clips

Electronics Forum | Fri Apr 13 08:02:59 EDT 2007 | maclites

I can post that info when we get it from our design team. All we have right now is a drawing and a BOM calling out "mini fuse" of 5 different values. The clip/socket is not called out at all, but going by the shape on the asembly drawing & mask lay

SMT REWORKING ( BGA )

Electronics Forum | Fri Apr 13 04:58:05 EDT 2007 | bartlozie

Hello, we do have very good results with a 'hot air' repair station, and poor results with a 'IR' repair station, but i have to say that the 'IR' station wasn't designed for leadfree use. Make sure you have a good underside heater, adjustable and


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