Electronics Forum: design (Page 351 of 537)

Re: Wave Soldering Active Components

Electronics Forum | Tue Mar 23 10:16:22 EST 1999 | Chrys Shea

| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto

Re: Makin That Drat Documentation

Electronics Forum | Sat Mar 06 08:19:50 EST 1999 | Dave F

| Clarissa, | | Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for t

Re: Selective Wave Solder Palletizing

Electronics Forum | Tue Feb 09 10:16:15 EST 1999 | Jim Gleason

Earl, We have found that many people get closer to a zero defect program using pallets. Since you eliminate manula masking you eliminate on huge area of possible defects production. Since the pallets can align connectors etc, you get less defects due

Re: Assembly of CSP on pads with vias.

Electronics Forum | Sat Jan 23 16:31:09 EST 1999 | Steve Gregory

| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern

Re: pc design/layout software

Electronics Forum | Thu Jan 14 15:03:57 EST 1999 | Earl Moon

| I need to buy modestly priced pc layout software for very infrequent use for very simple microwave and analog surface mount multi-layer boards. Can any one recommend a software package which is easy to learn, runs on a Windows PC and interfaces wit

Re: Process Control (Stencil Printer)

Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon

| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach

Re: 20 mil pitch applications

Electronics Forum | Fri Jan 08 16:48:13 EST 1999 | Earl Moon

| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what ac

Selective bridging?

Electronics Forum | Mon Jan 04 11:59:41 EST 1999 | Steve Evers

| Give me your opinions and experiences of SelectX, selective debridging system in the Vitronics Soltec wave soldering machines. | Opinion and (food for thought)?: First let me say that I am not familiar with SelectX. In the past, manufacturing e

Re: Simultaneous Double Sided Reflow

Electronics Forum | Tue Dec 29 12:18:17 EST 1998 | Ryan Jennens

| | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | Is there any one who has been running this process in production ? | | | | Yes I do mean

Re: CSP/BGA Assembly Problems

Electronics Forum | Tue Dec 29 11:40:24 EST 1998 | Michael Allen

I don't have answers...just comments. We're just starting to assemble CSPs on protos, and I've got the same concerns you have. The MicroBGA package I'm working with has a ball diameter of 0.325mm (0.0128") and a standoff of just 0.010" BEFORE solde


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