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Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Thu Apr 05 08:02:33 EDT 2001 | brownsj
I used to work for a company called Intelligent Reasoning Systems Incorporated. http://www.irsinc.com based in Austin Texas. They manufactured two different AOI systems depending on the component packages you wanted to inspect. The good thing about t
Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj
You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr
Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
Electronics Forum | Tue Apr 24 08:31:36 EDT 2001 | davef
First, you found THE place already!!! Read the Archives, current and previous Newsletters, technical papers, terms & definitions, etc Second, magazines ... Assembly magazines http://smt.pennnet.com/home.cfm http://www.cassembly.com/ http://www.ep
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Thu Jul 20 13:57:04 EDT 2000 | Boca
I am not answering for Techguy2000, but I am chiming in here, I have the same problem. Our resistor packs are ceramic body with no leads, they have a metalized area reminicent of the old castelation leads of year gone by. The lead pitch is 50 mil
Electronics Forum | Wed May 09 11:05:26 EDT 2001 | davef
IPC-7525 "Stencil Design Guidelines" �9 END OF LIFE, states "Stencils should be inspected periodically for damage that would conribute to decreased printing performance. Refer to Section 7 for inspection guidelines." Or words to that effect. Now b
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