Electronics Forum | Tue Jul 31 10:41:49 EDT 2001 | ronho
I'm interested in process information from someone who has experience with this package, such as pad design, stencil aperture dimensions, stencil thickness, unique issues, profiling, solder paste. Design is considering this package for future produc
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Wed May 19 11:02:41 EDT 1999 | Glenn Robertson
| I am designing a component for surface mount. Does anybody out there specialize in the design of passive components for SMT? Can you recommend a good reference? | Raffi - Many companies have their own specs for parts, but I suggest you check
Electronics Forum | Tue May 11 12:58:14 EDT 1999 | Dave F
| Would like are to know if there CAD 13/14 compatible PCB design component parts,config standard, schematic symbols, libraries and other software available as freeware, shareware for beginners at PCB design. | | R.L.Ottaway | | RL: There's a f
Electronics Forum | Wed Jul 22 09:58:02 EDT 1998 | LeeAnne
I'm trying to put together a set of design guides for use for new designers in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testpoint
Electronics Forum | Fri Feb 20 16:39:51 EST 1998 | Jim Blankenhorn
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Tell us more. How can it be done and what does it take from a design level. What about solder dra
Electronics Forum | Thu May 02 09:34:25 EDT 2002 | davef
A link to the UIC PTH design guidelines mentioed above: http://www3.uic.com/pp/throughhole.nsf/83e9f45c11caa9d58525647300561fe6/57860e0c453ee097852568ff0070b458/$FILE/Through%20Hole%20Design%20Guidelines.pdf
Electronics Forum | Wed Feb 05 08:20:14 EST 2003 | mbroadway
I'm new to the smt game. I'm trying to learn the basics of stencil design. I've just been tasked with removing and replacing a couple of mictor connectors. I need to find/design stencils for the solder paste. These boards are proprietary, and we don'
Electronics Forum | Sun Oct 13 22:20:50 EDT 2002 | craigj
Have had a request from a customer who wants to use component reference designators of 6 or more charactors. They have a good reason for this from a design point of view but it becomes a problem at manufacture. Our machine (also MRP system) only allo
Electronics Forum | Mon Dec 09 08:13:06 EST 2002 | MA/NY DDave
Hi Yes it is common to design for more uniform heat transfer during the soldering phase or even during the operation phase. It all depends on how bad the problem is during automated assembly or during usage. The only difficulty is that the designer
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