Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas
We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen
Electronics Forum | Wed Aug 01 16:03:19 EDT 2018 | tey422
dwl, thanks for your feedback. The 1st option would not be possible, due to customer wants to keep the board as it is. Epoxy would be one of the next thing I would do if no other possible design that might works. I am not sure of the volume yet, I am
Electronics Forum | Fri Sep 07 11:46:29 EDT 2018 | dleeper
Air gap on the PCB is determined the pad spacing which in turn is governed by the component. As long as the PCB designer is following the typical BGA layout best practices; i.e no open via in pad, non-solder mask defined pads, solder mask covered tra
Electronics Forum | Tue Nov 06 10:06:33 EST 2018 | davef
Electronic Connector Industry News Resources + Surface Finishing + Metal Finishing + Products Finishing + Interconnection World (Connector Specifier) Electronic Connector Associations + IEEE USA + International Electronics Manufacturing Initiative (
Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef
That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins
Electronics Forum | Thu May 30 09:33:15 EDT 2019 | emeto
Contributors in order of importance: 1. PCB design - if you have large thermal pads, a grid of via holes should be created. Components with low profile will not let the gas to escape from the joint. The only way is going down. 2. Reduce paste volum
Electronics Forum | Fri Jul 26 06:16:02 EDT 2019 | spoiltforchoice
We have enough volume/oversized products that batch vapor doesn't quite work. Once you move into the quasi inline or fully inline vapor system they become eye-wateringly expensive. Plus you get an entirely new process to learn, potentially increased
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Mon Jan 06 20:53:23 EST 2020 | mikeyg12
Hello everyone! I have had this idea in my head to DIY a desktop KVM (without the V so I guess just a KM) board that I can solder USB A headers to with a DPDT switch. I designed the board and when I thought it was all good to go I proudly sent it of
Electronics Forum | Mon Feb 10 10:41:29 EST 2020 | SMTA-Tony
Hello Phil, As the other respondents have mentioned, the cooling rate is not easily controlled and varies based on the oven and board design, as well as the settings of the last few zones and cooling zones. In general, the board is going to cool in
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