Electronics Forum | Wed Sep 20 19:34:13 EDT 2000 | Dave F
Congrats. You now control the source of almost 70% of the defects of your SMT operation. There is a neat series of presentations on printing, each year at SMI. One of the best of the SMI series was in 1997, because presenters used a common board
Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish
Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the
Electronics Forum | Sun Aug 06 16:37:00 EDT 2000 | fraser
1. A step stencil is a waste of perfectly good stainless steel! 2. They are characterised by lousy prints on the very parts that are most critical in your process - whilst leaving good prints on the easy stuff. 3. MMM.... nasty chemicals! 4. Exactly!
Electronics Forum | Fri Jun 16 06:24:43 EDT 2000 | Wolfgang Busko
Hi Todd, it might be a philosophical question if soldermask between finepitch pads is prefered or not. That should depend on the capabilities of a particular site and their experience. We actually prefer soldermask down to 0,4mm pitch and don�t have
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp
CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly
Electronics Forum | Wed Apr 11 00:17:03 EDT 2001 | Dreamsniper
Hi, We got a 0.5mm pitch QFP144 from Altera with the below lead width specs. min. lead width = 0.17mm nominal = 0.22mm maximum = 0.27 What's the best pad or land width for the above? This is what our designer used. Land Width = Component Lead Wi
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Sun Jun 10 12:15:37 EDT 2001 | procon
Hello Danial, Leave it up to most to blame the relow oven for their tombstoning problems when in fact it is usually the last to cause it. The biggest culprit of tombstoning is the pad design followed by the print quality. Usually, we find that the p
