Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Mon Jun 25 11:09:26 EDT 2001 | wbu
Who is this, another Dave F ? For me there�s no problem with balling and beading. I know that the boards I have with the new paste do have all what�s needed for balling and beading, just one of the oldest designs with a stencil ...., oh boy, didn�t
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Sat Jun 30 14:17:53 EDT 2001 | stefwitt
I would highly recommend that you test drive your vehicle before you buy it. Buy a test kit from Topline and have a stencil made. Make an appointment with the machine manufacturer and let them know that you come with your own boards and components.
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
Electronics Forum | Mon Jul 02 14:47:24 EDT 2001 | gdstanton
Thanks. I saw your response to Gabby on May 23 2000. Sent a request to Christina Cotto at Reedexpo.com. She's going to send me copies of the Nepcon papers you referenced. Although, I did some guestimating and ballparked a monthly cost of $338k
Electronics Forum | Sat Jun 30 11:05:31 EDT 2001 | davef
Sohowcum, yer not just sending the bent-up leaded QFP back to the sorry behinds that sent them to you and telling �em they aint no good!!! Gimme goodins!!! [Er, words to that effect.] For QFP lead reconditioning equipment suppliers, try: * Knight
Electronics Forum | Thu Jul 19 21:55:14 EDT 2001 | davef
You're correct, but you need to take it a little bit further. Installed correctly, ExposedPad� TSSOP IC packages significantly increase the thermal efficiency of power constrained standard TSSOP packages. This can increase heat dissipation by as mu
Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
Electronics Forum | Thu Jul 26 06:39:19 EDT 2001 | nifhail
How do you guys monitor your feeder's history/record. Is there any database available in the market to keep track feeders in your line such as caliration's due date, last calibration dates etc. ( basically the historical data for individual tracking)
