Electronics Forum | Wed Nov 14 20:30:26 EST 2001 | davef
Tks. So was the answer that you got close? [ala "Car Talk"] Some guy from Cal-fornie sends me spill. I get cigars from � Yeh, I know I hog the responses, but I learn by doing this. If I can communicate in print, I can better communicate in word
Electronics Forum | Wed Nov 28 20:14:50 EST 2001 | ianchan
Hi, i'd second that choice of enineering degree in electronics as monkey says, coz of variable options open to you IF you decide to rotate in your field of applicable enggr interests... IT courses are abundant in today's "open Uni" learning "econom
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Fri Nov 30 17:33:12 EST 2001 | slthomas
After saying for years that we'd never do two-sided assembly, the powers that be are not only saying we will, but they're threatening to throw an out of house design at us...no frame (it's a PCI card with a couple of dinky breakaway tabs), no tooling
Electronics Forum | Wed Dec 26 14:19:52 EST 2001 | Stefan
I find that software is a quite individual part of the entire machine. Some programmers love to have at least 20 windows open at one time and others prefer to put all information on one single page. What appears to be easy for one, may be difficult f
Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef
Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla
Electronics Forum | Thu Feb 14 20:24:07 EST 2002 | scott
My first reaction would be to run! FAST! Flex -- well, it... flexes... and isn't flat. While you assemble it, While you transport it, While it goes through the oven... SMT Connectors typically need to be held down during reflow. Fiducial types are
Electronics Forum | Wed Feb 20 13:23:33 EST 2002 | dgeorge
I have some interesting problems on my hands that some of you may know the answers to. I am currently wave soldering a through hole connector to a rigidized flexible circuit. This is a compliant pin connector that is supposed to be pressed into a h
Electronics Forum | Thu Feb 28 16:40:04 EST 2002 | liviuj
>Dear SMTneter, >>I am loonkig for some information about how to rework a >>BGA. >>Some technical info explaing how to put solder past >>manualy, soldering manualy, tips and so on. >>Where can I find something about? >>Thanks in advance >>Marcos Hi
Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon
I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para
