Electronics Forum | Sat Jan 06 10:52:09 EST 2001 | Steve Thomas
I don't know the specs. of our MSHII's, as I'm sort of detached from that part of the process, but supposedly they are capable. Panasonic also recommends we buy all new feeders (well, big surprise there), because of the risks involved with retrofitti
Electronics Forum | Wed Mar 27 19:56:49 EST 2002 | bmiklosey
I am not sure why there is an attack on the CircuitCAM product from 'M Cox', especially when he appears to be mis-formed about the operations within its well developed Gerber environment. CircuitCAM does automate the reference designator identifier
Electronics Forum | Thu Nov 30 16:23:42 EST 2000 | Michael Parker
Hello Reno- Rather than capitalize with expensive equipment and spend a lot of time teaching yourself the right way to process, have you considered finding a Contract Manufacturer to help you? A good CM who specializes in New Product Introduction (N
Electronics Forum | Wed Nov 29 21:05:33 EST 2000 | Michael Parker
Chris- you did not mention some details regarding your processes and volumes. Are you using SMT, PTH, mixed? Machinery involved (automatic vs. manual). Volumes - same 4-20 assemblies, at what periodic rate? Are you doing R&D prototypes only? High or
Electronics Forum | Sat Dec 02 21:21:11 EST 2000 | Murad Kurwa
Our NPI division is in a same category. We assemble small quantities and lot of different set-ups. I created a DPMO charting method using Excel that we use at Post Reflow, Post Wave and Final QC. In addition, we use x-r charts at screen print for con
Electronics Forum | Wed Nov 15 11:00:35 EST 2000 | Finepitch Services
"depending on your pad design"... To me, Wolfgang gave you the biggest secret... I guess he meant the real pad width you get on your board is the start point. Get the average measurement in mils and then cut it from the sides at the percentages he h
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Thu Sep 14 19:44:25 EDT 2000 | Brian W.
I cannot give references to papers, etc, but I can tell you from experience that High Impedance circuits and High Power RF circuits are not something to try no-clean on. For an aerospace customer, I had a circuit that any residue left between two pa
Electronics Forum | Fri Sep 15 09:24:54 EDT 2000 | C.K.
At my last place of employment, that was the big reason why nobody (especially the Design Engineers) bought into a no-clean process - interference with high-impedance circuits. One guy was so paranoid about flux residues remaining on the board, that
Electronics Forum | Tue Jul 18 03:49:43 EDT 2000 | Chris May
50% of cost, bin it. If viable, spend no more than that time to fix. Then concess or use as is. 3) Components are more tricky. Can they be returned to supplier if deemed to be faulty? (proof?). Is/was there an in-house handling problem ? Have design
