Electronics Forum | Tue Mar 27 18:58:36 EST 2001 | Mike Konrad
Hi Kerry, You are putting too much emphasis on the EPA�s �ENVIRONMENTAL TECHNOLOGY VERIFICATION STATEMENT� Consider the following EPA statement taken from the specific EPA report that you site: �� the end-user should contact his/her local, state,
Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
Electronics Forum | Mon Apr 30 10:06:13 EDT 2001 | CAL
John- Just few ideas at random (brainstorming) - While times are slow invest in training of your current staff. There are some great training facilities out there offering valuable knowledge. Knowledge is a valuable thing to have and will prove to be
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Thu Jun 22 13:12:47 EDT 2000 | Lee
Good question Brian. I'll answer this briefly and try to get back to the subject after I get back from a meeting I have to be at shortly (sorry about that!). There are lots of ways to define this new field, but one relatively simple definition is u
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
Electronics Forum | Thu May 24 16:45:57 EDT 2001 | kmorris
Hi All: We�ve got a problem here with opens on bottom side wave soldered SOT23s. Based on past experience and review of the SMTnet archives, I feel that our main problem is pad size. We have the same size pads for bottom side SOT23s as we have for
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Thu Jun 14 20:56:02 EDT 2001 | davef
See, now you know how you got the job!!! ;-) Assuming you mean solder mask, that stuff is designed to be tough to remove. It�s an epoxy meant to protect the board features from the ravages of board fabrication and everyday life. Your choices are:
Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig
Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of
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