Electronics Forum | Thu Jan 04 17:04:43 EST 2007 | slthomas
99% good solder joints = 10000 ppm (defects per million opportunities). Having only built with 0603s I can't speak for a target but that still seems pretty harsh....with a 75/25 0805/0603 ratio at my last place of employment I think we were running
Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514
as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller
I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo
Electronics Forum | Thu Jan 11 09:19:56 EST 2007 | SMTRework
I know this is not the correct forum to post chip "reworking" questions but you guys have been very helpful in the past. My question is this, when we rework BGA components most of the time the solder reflows at a normal temp and all is well. On occ
Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW
Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig
Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Mon Feb 12 09:51:51 EST 2007 | rgduval
From what I see, you have a couple of options... 1. Hand solder the secondary side LED's. This is only a good option if you're going to be at low-ish volumes. Higher volumes tend to necessitate more automation to reduce production costs. However
Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)
Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
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