Electronics Forum | Tue Oct 13 00:50:58 EDT 1998 | Hossam Alzomor
how to buy a used or new equipments for pcb industry and a good s/w for design and simulation Eng\Hossam Alzomor Egypt
Electronics Forum | Fri Oct 02 17:33:30 EDT 1998 | Jerry Stafford
Anyone know of someone who can convert mylar top layer board data to Gerber data? We have some old designs that all other data is now lost.
Electronics Forum | Thu Sep 24 14:49:18 EDT 1998 | Paul Gliesman
I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design.
Electronics Forum | Thu Sep 17 03:32:31 EDT 1998 | Thomas Blesinger
can anyone help with information about I-shape of SMDs. our Design includes this shape of contacts. we are searching for information on quality judgement of solder joints with I-leads on Pads. Please help.
Electronics Forum | Fri Aug 21 15:03:42 EDT 1998 | Dave F
| How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these? Steve: People on TechNet have spent alot of time talking about BGA pad design. Use the link below. Dave
Electronics Forum | Sun Aug 02 06:54:26 EDT 1998 | Bob Willis
You may liketo contact Chemtech in the UK. http://chemteck.co.uk as they have a new hand book on stencils and a design guide due for release shortly there is also some stencil information as a survey on types and price on my web sites under surveys h
Electronics Forum | Fri Jul 24 01:28:00 EDT 1998 | Alex Ondi
I also heard of a company considering a patent on aperture design. The aperture was a "chevron" aperture, very similar to the "V" shaped aperture recently touted in SMT magazine, presumably for the purpose of reducing solder balls. Go figure!
Electronics Forum | Mon Jun 29 12:15:02 EDT 1998 | coogan
Does the current Panasonic / KME bulk feeder design use the indexing concept developed by Taiyo Yuden (Japan), or is it based on the Nitto (pneumatic) concept?
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 14:17:12 EDT 1998 | Earl Moon
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
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