Electronics Forum | Mon Nov 22 17:32:34 EST 2004 | davef
Assemblers often assume that the board and component suppliers provide them with clean product. This was not a problem when everyone used water washable fluxes, because the water washing used to clean the flux residues also cleaned the board and com
Electronics Forum | Tue May 03 09:47:03 EDT 2005 | denismeloche
We sell rework stations for all kind of components and boards. The systems are designed to fit a particular size board and it's very difficult to design a one size fits all system. I personally have a lot of experience reworking high mass, high hea
Electronics Forum | Tue May 03 22:53:54 EDT 2005 | MikeaJ
I 100% agree, KEN is absolutely right. If your machine is equipped with a stencil cleaner, and it is the original SMTech USC with the full length bar, you are in trouble already. If your software is of an earlier vintage, upgrade ASAP. Anything less
Electronics Forum | Thu May 12 04:37:30 EDT 2005 | Rob
1) Only if it's a real enhancement, and not to fix a fault in your design. 2) No, it just has to be instinctive & accurate. 3) Barcode is fine by me, but others swear by data matrix 4) Better than 1 in 10,000 - which could be once every 5 boards.
Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
Electronics Forum | Wed Jul 20 16:51:03 EDT 2005 | pjc
There is a spec I read that states +/- 0.001" (0.025mm) print deposition accuracy and repeatability is more than adequate for 0201-chip printing. I don't think any print studies where done for 01005 chips yet. There are several other factors besides
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Sat Mar 11 15:05:54 EST 2006 | Kerm
Hi Craig: I agree with muse. The problems almost always will show up later on duringg life cycles in terms of reliability problems. While the solder joints may look acceptable right after production there is no guarantee of meeting the reliability r
Electronics Forum | Thu Jun 08 04:31:24 EDT 2006 | vasily
Hi First I think you have to analize your PCB design. Heavy weight components should be gathered on one side of PCB. As I think, if you want to reflow both sides simultaneously there might be a problem. A chance that large components will drop off
Electronics Forum | Fri Dec 08 02:40:45 EST 2006 | Mike Konrad
Hi 'K', We manufacture both batch and inline defluxing equipment so we have no axe to grind with either technology. There are pros and cons associated with both technologies under specific conditions. Batch machines are typically good cleaners but
